SRI HERMETICS creates unique solutions by using advanced processes such as laser welding, explosion welding or diffusion bonding. This allows us to combine some of the best materials into one solution that provides optimum performance for all conditions. SRI HERMETICS provides fully connectorized electronic packaging in many materials including aluminum, titanium, stainless steel, copper alloys, aluminum composite, copper/molybdenum composite as well as the conventional ferrous alloys like alloy 46 and Kovar. SRI has the technology to combine many of these materials to give our customers the optimum material performance for weight, thermal conductivity, thermal expansion and cover sealing processes. One example of this technology is our aluminum composite titanium packaging. The aluminum composite material provides excellent weight, thermal and CTE properties while the titanium provides a surface to laser weld a cover. into place.
