ICOS was founded in 1982 as a spin-off from the K.U. Leuven Image Processing Laboratory, under the leadership of Professor Dr. Ir. Oosterlinck who has become president of the university and is still an active member of the Board of Directors. After performing various inspection tasks in various industries, ICOS decided in 1985 to concentrate entirely on the back-end semiconductor and electronic assembly industries. We landed some of our first OEM contracts which are still in place today and started a period of rapid growth, resulting in ICOS becoming a world-wide leader for inspection systems for IC packages and packaging processes and materials. Since 1982, ICOS has introduced several important innovations to the market, like a true greyscale vision system for IC placement and several of the world's first inspection systems for integration in various types of back-end semiconductor equipment. By the early nineties, ICOS had become a leading choice of OEM's for inspection systems in the semiconductor back-end arena. ICOS then adopted a strategy of vertical integration and started to build more complete inspection systems. We expanded our product line, starting from our original board-level inspection modules to system-level modules (including cameras and illumination systems) and finally into stand-alone inspection systems, of which it introduced its first version in 1992. In the process of specializing in semiconductor package inspection, ICOS embarked on a geographical expansion. In 1986, we established a subsidiary in the USA, followed by a subsidiary in Japan in 1991, two years after recording our first sales in this important market. Following these early successes, we entered other markets in Asia, opening a branch office in Hong Kong in 1995 and in Singapore in 1996. The operations of both branches were transferred to newly incorporated subsidiaries in 2003. In 2004, we also set up an office in Korea. In 1997 we listed our stock on the Nasdaq Stock Market in an initial public offering, adding a dual listing on the European technology stock market, Nasdaq Europe, in 1998. In 2003, we exchanged our Nasdaq Europe listing for a listing on Euronext Brussels, so that we currently have a dual listing on NASDAQ (USA) and Euronext Brussels. We have continued to expand our technology platform and broaden our line of inspection machines. In 1998, we acquired Qtec, a German leader in IC inspection equipment for very specific stages in the IC production process. Today ICOS GmbH, the former Qtec, serves as a research and development department for the company. During 2002, we acquired the gravity handling technology and product rights from IC Equipment Pte Ltd. in Singapore and we opened our R&D center in Hong Kong, concentrating on mechanical design. During 2004, we acquired our production plant in Shenzen, China, right across the border from and closely working together with our R&D center in Hong Kong and we took over the 2D Wafer Inspection technology of Siemens AG. With this acquisition, ICOS enters the market of 2D Wafer Inspection and expands its addressable market for inspection of semiconductor packacagin processes.
Lam Research Corporation (Lam Research) is a supplier of wafer fabrication equipment and services to the worldwide semiconductor industry. The Company designs, manufactures, markets, and services semiconductor processing equipment used in the fabrication of integrated circuits. Semiconductor wafers are subjected to a complex series of process and preparation steps that result in the simultaneous creation of many individual integrated circuits. Its etch and clean technologies enable customers to build integrated circuits. Lam Research’s etch systems shape the microscopic conductive and dielectric layers into circuits that define a chip’s final use and function. Its portfolio of single-wafer clean technologies allows its customers to implement customized yield-enhancing solutions. (Source: 10-K)
Genus, Inc. is engaged in supplying manufacturing systems to the semiconductor industry worldwide. Semiconductor manufacturers use its thin film deposition equipment and process technology to produce integrated circuits, commonly called chips, which are incorporated into a variety of products, including personal computers, communications equipment and consumer electronics. The Company also develops chemical vapor deposition tungsten silicide that is used in certain critical steps in the manufacture of integrated circuits. It is in the commercialization of atomic layer deposition, also known as ALD technology. This technology is designed to enable a spectrum of thin film applications, such as aluminum oxide, hafnium oxide and other insulating and conducting materials for integrated circuit manufacturing. (Source: 10-K)
Axcelis Technologies, Inc. (Axcelis) designs, manufactures and services ion implantation, dry strip and other processing equipment used in the fabrication of semiconductor chips. In addition to equipment, Axcelis provides aftermarket service and support, including spare parts, equipment upgrades, maintenance services and customer training. The Company also owns 50% of the equity of SEN Corporation (SEN), a producer of ion implantation equipment in Japan. SEN licenses technology from the Company for certain ion implantation products and has exclusive rights to market the licensed products in Japan. In September 2007, Axcelis discontinued future development of the thermal processing and photostabilization/curing product lines. (Source: 10-K)
Ibis Technology Corporation (Ibis) develops, manufactures and markets SIMOX-SOI implantation equipment for the worldwide semiconductor industry. Separation by implantation of oxygen (SIMOX), is a form of silicon-on-insulator (SOI) technology that creates an insulating oxide barrier below the top surface of a silicon wafer through implantation and annealing. The Company's oxygen implanters produce SIMOX-SOI wafers by implanting oxygen atoms just below the surface of a silicon wafer to create a thin layer of silicon dioxide between the thin operating region of the transistor at the surface and the underlying silicon wafer itself. The buried layer of silicon dioxide acts as an insulator for the devices fabricated on the surface of the silicon wafer and reduces the electrical current leakage, which otherwise slows integrated circuit performance, and/or increases the loss of power during circuit operation. (Source: 10-K)
Ultratech, Inc. develops, manufactures and markets photolithography and laser thermal processing equipment designed for manufacturers of integrated circuits, including advanced packaging processes and various nanotechnology components, thin film head magnetic recording devices (thin film heads or TFHs), optical networking devices, laser diodes and light emitting diodes (LEDs). The Company supplies step-and-repeat photolithography systems based on one-to-one (1X) imaging technology to customers located throughout North America, Europe, Japan and the rest of Asia. The Company’s steppers are used to manufacture semiconductors used in a variety of applications, such as telecommunications, automotive control systems, power systems and consumer electronics. It also supplies 1X photolithography systems to thin film head manufacturers. The Company offers the 1000 Family and AP series of 1X lithography systems for use in the semiconductor. (Source: 10-K)
MEMC Electronic Materials, Inc. is engaged in the design, manufacture and sale of silicon wafers. The Company provides wafers in sizes ranging from 100 millimeters (four inch) to 300 millimeters (12 inch). It offers wafers in three general categories: prime, epitaxial and test/monitor. Depending on market conditions, the Company also sells intermediate products, such as polysilicon, silane gas, partial ingots and scrap wafers to semiconductor device and equipment makers, solar customers, flat panel and other industries. The Company offers wafers with a variety of features to meet the customers’ requirements. The wafers are used as the starting material for the manufacture of various types of semiconductor devices, including microprocessor, memory, logic and power devices, as well as the starting material for solar cells. (Source: 10-K)
Veeco Instruments Inc. (Veeco) designs and manufactures enabling solutions for customers in the high brightness light emitting diode (HB-LED), solar, data storage, semiconductor, scientific research and industrial markets. Veeco has three segments: LED & Solar Process Equipment, Data Storage Process Equipment, and Metrology. LED & Solar segment designs and manufactures metal organic chemical vapor deposition (MOCVD) systems, molecular beam epitaxy (MBE) systems and sources, and other types of deposition systems. Data Storage segment designs and manufactures ion beam etch, ion beam deposition, diamond-like carbon, physical vapor deposition, and dicing and slicing products. Metrology segment designs and manufactures atomic force microscopes (AFMs), stylus profilers and optical interferometers. (Source: 10-K)
http://www.avizatechnology.com
Aviza Technology, Inc. designs, manufactures, sells and supports semiconductor capital equipment and process technologies for the global semiconductor industry and related markets. The Company’s systems are used in a variety of segments of the semiconductor market, including silicon processing for memory devices, advanced three-dimensional (3-D) packaging and power integrated circuits (ICs) for communications. The Company focuses on designing systems that enable device manufacturers to meet technological and manufacturing requirements. Aviza Technology, Inc. offers both front-end-of-line and back-end-of-line systems and process technologies used for the aforementioned markets addressing critical thin film formation technologies, including atomic layer deposition (ALD), physical vapor deposition (PVD), chemical vapor deposition (CVD), plasma etch (Etch) and thermal processing systems. (Source: 10-K)
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